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W24257A 32K x 8 HIGH SPEED CMOS STATIC RAM
GENERAL DESCRIPTION
The W24257A is a high speed, low power CMOS static RAM organized as 32768 x 8 bits that operates on a single 5-volt power supply. This device is manufactured using Winbond's high performance CMOS technology.
FEATURES
* *
High speed access time: 35 nS (max.) Low power consumption:
-
* * *
All inputs and outputs directly TTL compatible Three-state outputs Available packages: 28-pin 600 mil DIP, 330 mil SOP, 300 mil SOJ and standard type one TSOP (8 mm x 13.4 mm)
Active: 350 mW (max.)
* *
Single +5V power supply Fully static operation
PIN CONFIGURATIONS
BLOCK DIAGRAM
VDD VSS
A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O1 I/O2 I/O3 VSS
1 2 3 4 5 6 7 8 9 10 11 12 13 14 28-DIP
28 27 26 25 24 23 22 21 20 19 18 17 16 15
VDD WE A13 A8 A9 A11 OE A10 CS I/O8
A0 . . A14
DECODER
CORE ARRAY
CS OE WE CONTROL DATA I/O I/O1 . . I/O8
I/O7 I/O6 I/O5 I/O4
PIN DESCRIPTION
SYMBOL DESCRIPTION Address Inputs Data Inputs/Outputs Chip Select Input Write Enable Input Output Enable Input Power Supply Ground A0-A14 I/O1-I/O8 CS WE OE VDD VSS
OE A11 A9 A8 A13 WE VDD A14 A12 A7 A6 A5 A4 A3
1 2 3 4 5 6 7 8 9 10 11 12 13 14
28-pin TSOP
28 27 26 25 24 23 22 21 20 19 18 17 16 15
A10 CS I/O8 I/O7 I/O6 I/O5 I/O4 VSS I/O3 I/O2 I/O1 A0 A1 A2
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Publication Release Date: January 1998 Revision A6
W24257A
TRUTH TABLE
CS H L L L OE X H L X WE X H H L MODE Not Selected Output Disable Read Write I/O1-I/O8 High Z High Z Data Out Data In VDD CURRENT ISB, ISB1 IDD IDD IDD
DC CHARACTERISTICS
Absolute Maximum Ratings
PARAMETER Supply Voltage to VSS Potential Input/Output to VSS Potential Allowable Power Dissipation Storage Temperature Operating Temperature RATING -0.5 to +7.0 -0.5 to VDD +0.5 1.0 -65 to +150 0 to +70 UNIT V V W C C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device.
Operating Characteristics
(VDD = 5V 10%, VSS = 0V, TA = 0 to 70 C)
PARAMETER Input Low Voltage Input High Voltage Input Leakage Current Output Leakage Current Output Low Voltage Output High Voltage Operating Power Supply Current Standby Power Supply Current
SYM. VIL VIH ILI ILO
TEST CONDITIONS VIN = VSS to VDD VI/O = VSS to VDD, CS = VIH (min.) or OE = VIH (min.) or WE = VIL (max.) IOL = +8.0 mA IOH = -4.0 mA CS = VIL (max.), I/O = 0 mA, Duty = 100%
f = fmax. f = 50 MHz
MIN. -0.5 +2.2 -10 -10
TYP. -
MAX. +0.8 VDD +0.5 +10 +10
UNIT V V A A
VOL VOH IDD
2.4 -
-
0.4 100 130
V V mA
ISB ISB1
CS = VIH (min.) Cycle = min., Duty = 100% CS VDD -0.2V
-
-
30 10
mA mA
Note: Typical characteristics are at VDD = 5V, TA = 25 C.
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W24257A
CAPACITANCE
(VDD = 5V, TA = 25 C, f = 1 MHz)
PARAMETER Input Capacitance Input/Output Capacitance
SYM. CIN CI/O
CONDITIONS VIN = 0V VOUT = 0V
MAX. 8 10
UNIT pF pF
Note: These parameters are sampled but not 100% tested.
AC CHARACTERISTICS
AC Test Conditions
PARAMETER Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level Output Load 0V to 3V 5 nS 1.5V CL = 30 pF, IOH/IOL = -4 mA/8 mA CONDITIONS
AC Test Loads and Waveform
R1 480 ohm R1 480 ohm 5V OUTPUT 30 pF Including Jig and Scope R2 255 ohm 5V OUTPUT 5 pF Including Jig and Scope R2 255 ohm
(For TCLZ, TOLZ , TCHZ, TOHZ , TWHZ , TOW)
3.0V
90% 10% 5 nS
90% 10% 5 nS
0V
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Publication Release Date: January 1998 Revision A6
W24257A
AC Characteristics, continued (VDD = 5V 10%, VSS = 0V, TA = 0 to 70 C)
Read Cycle
PARAMETER SYMBOL W24257A-35 MIN. Read Cycle Time Address Access Time Chip Select Access Time Output Enable to Output Valid Chip Selection to Output in Low Z Output Enable to Output in Low Z Chip Deselection to Output in High Z Output Disable to Output in High Z Output Hold from Address Change These parameters are sampled but not 100% tested. TRC TAA TACS TAOE TCLZ TOLZ TCHZ TOHZ TOH 35 3 0 3 MAX. 35 35 17 17 17 nS nS nS nS nS nS nS nS nS UNIT
Write Cycle
PARAMETER SYMBOL W24257A-35 MIN. Write Cycle Time Chip Selection to End of Write Address Valid to End of Write Address Setup Time Write Pulse Width Write Recovery Time Data Valid to End of Write Data Hold from End of Write Write to Output in High Z Output Disable to Output in High Z Output Active from End of Write These parameters are sampled but not 100% tested. CS, WE TWC TCW TAW TAS TWP TWR TDW TDH TWHZ TOHZ TOW 35 20 20 0 18 0 15 0 0 MAX. 15 15 nS nS nS nS nS nS nS nS nS nS nS UNIT
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W24257A
TIMING WAVEFORMS
Read Cycle 1
(Address Controlled)
TRC Address TOH DOUT TAA TOH
Read Cycle 2
(Chip Select Controlled)
CS TACS DOUT TCLZ TCHZ
Read Cycle 3
(Output Enable Controlled)
T RC Address TAA OE TAOE TOLZ CS TACS DOUT TCLZ T CHZ TOHZ TOH
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Publication Release Date: January 1998 Revision A6
W24257A
Timing Waveforms, continued
Write Cycle 1
(OE Clock)
TWC Address T WR OE
TCW CS TAW WE TAS TOHZ DOUT TDW DIN TDH (1, 4) TWP
Write Cycle 2
(OE = VIL Fixed)
T WC Address TCW CS TAW WE TAS TWP TWHZ (1, 4) TOH (2) TOW (3) TWR
DOUT
TDW DIN
TDH
Notes: 1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied. 2. The data output from DOUT are the same as the data written to DIN during the write cycle. 3. DOUT provides the read data for the next address. 4. Transition is measured 500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested.
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W24257A
ORDERING INFORMATION
PART NO. ACCESS TIME (nS) 35 35 35 35 OPERATING CURRENT MAX. (mA) f = max. 100 100 100 100 OPERATING CURRENT MAX. (mA) f = 50 MHz 130 130 130 130 STANDBY CURRENT MAX. (mA) 10 10 10 10 PACKAGE
W24257A-35 W24257AS-35 W24257AJ-35 W24257AQ-35
Notes:
600 mil DIP 330 mil SOP 300 mil SOJ Standard type one TSOP
1. Winbond reserves the right to make changes to its products without prior notice. 2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure.
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Publication Release Date: January 1998 Revision A6
W24257A
PACKAGE DIMENSIONS
28-pin P-DIP
Dimension in Inches Dimension in mm
Symbol
Min. Nom. Max.
0.210 0.010 0.150 0.016 0.058 0.008 0.155 0.018 0.060 0.010 1.460 0.590 0.540 0.090 0.120 0 0.630 0.650 0.600 0.545 0.100 0.130 0.160 0.022 0.064 0.014 1.470 0.610 0.550 0.110 0.140 15 0.670 0.090
Min. Nom. Max.
5.33 0.25 3.81 0.41 1.47 0.20 3.94 0.46 1.52 0.25 37.08 14.99 13.72 2.29 3.05 0 16.00 16.51 15.24 13.84 2.54 3.30 4.06 0.56 1.63 0.36 37.34 15.49 13.97 2.79 3.56 15 17.02 2.29
D
28 15
A A1 A2 B B1 c D E E1 e1 L
a
E1
eA S Notes:
1 14
S
E c
A A2
A1
Base Plane Seating Plane
L B B1
e1
a
eA
1. Dimensions D Max. & S include mold flash or tie bar burrs. 2. Dimension E1 does not include interlead flash. 3. Dimensions D & E1 include mold mismatch and are determined at the mold parting line. 4. Dimension B1 does not include dambar protrusion/intrusion. 5. Controlling dimension: Inches. 6. General appearance spec. should be based on final visual inspection spec.
28-pin SO Wide Body
Dimension in Inches Dimension in mm
Symbol
Min. Nom. Max.
0.112 0.004 0.093 0.014 0.008 0.098 0.016 0.010 0.713 0.326 0.044 0.453 0.028 0.059 0.331 0.050 0.465 0.036 0.067 0.103 0.020 0.014 0.733 0.336 0.056 0.477 0.044 0.075 0.047 0.004 0 10
Min. Nom. Max.
2.85 0.10 2.36 0.36 0.20 2.49 0.41 0.25 18.11 8.28 1.12 11.51 0.71 1.50 8.41 1.27 11.81 0.91 1.70 2.62 0.51 0.36 18.62 8.53 1.42 12.12 1.12 1.91 1.19 0.10 0 10
28
15
e1
E
HE
L
Detail F
1 b 14
A A1 A2 b c D E e HE L LE S y Notes:
D
e1 c
A2 A
1. Dimensions D Max. & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimensions D & E include mold mismatch . and determined at the mold parting line. 4. Controlling dimension: Inches. 5. General appearance spec should be based on final visual inspection spec.
S
e
y
A1
LE
See Detail F Seating Plane
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W24257A
Package Dimensions, continued
28-pin Small Outline J Band
Dimension in Inches Dimension in mm
Symbol
Min. Nom. Max.
0.140 0.027 0.095 0.026 0.016 0.008 0.100 0.028 0.018 0.010 0.710 0.295 0.044 0.245 0.327 0.077 0.300 0.050 0.265 0.337 0.087 0.105 0.032 0.022 0.014 0.730 0.305 0.056 0.285 0.347 0.097 0.045 0.004 0 10
Min. Nom.
0.69 2.41 0.66 0.41 0.20 2.54 0.71 0.46 0.25 18.03 7.49 1.12 6.22 8.31 1.96 7.62 1.27 6.73 8.56 2.21
Max.
3.56
28
15
E
HE
1
14
D c A2 A L c e A1 y e1
A A1 A2 b1 b c D E e e1 HE L S y
Notes:
2.67 0.81 0.56 0.36 18.54 7.75 1.42 7.24 8.81 2.46 1.14 0.10
0
10
s Seating Plane
b b1
1. Dimensions D Max. & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimensions D & E include mold mismatch and are determined at the mold parting line. 4. Controlling dimension: Inches. 5. General appearance spec. should be based on final visual inspection spec.
28-pin Standard Type One TSOP
HD
Symbol Dimension In Inches Min. Nom. Max.
0.047 0.002 0.035 0.007 0.004 0.461 0.311 0.520 0.040 0.008 0.006 0.465 0.315 0.528 0.022 0.020 0.024 0.010 0.000 0 3 0.004 5 0.00 0 3 0.028 0.50 0.006 0.041 0.011 0.008 0.469 0.319 0.536 0.05 0.95 0.17 0.10 11.70 7.90 13.20 1.00 0.20 0.15 11.80 8.00 13.40 0.55 0.60 0.25 0.10 5 0.70
Dimension In mm Min. Nom. Max.
1.20 0.15 1.05 0.27 0.21 11.90 8.10 13.60
D c
1
e
E
b
A2 A
A A1 A2 b c D E HD e L L1 Y Y
L L1
A1
Controlling dimension: Millimeters
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Publication Release Date: January 1998 Revision A6
W24257A
VERSION HISTORY
VERSION A5 A6 DATE Mar. 1997 Jan. 1998 PAGE 1, 7 2, 7 2, 7 DESCRIPTION Add TSOP package Modify IDD data Modify IDD data
Headquarters
No. 4, Creation Rd. III, Science-Based Industrial Park, Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5796096 http://www.winbond.com.tw/ Voice & Fax-on-demand: 886-2-7197006
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II, 123 Hoi Bun Rd., Kwun Tong, Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064
Winbond Electronics North America Corp. Winbond Memory Lab. Winbond Microelectronics Corp. Winbond Systems Lab.
2727 N. First Street, San Jose, CA 95134, U.S.A. TEL: 408-9436666 FAX: 408-5441798
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd., Taipei, Taiwan TEL: 886-2-7190505 FAX: 886-2-7197502
Note: All data and specifications are subject to change without notice.
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